About this role
Senior Process Engineer - Die attach and assembly technologies at TNO. Location: Nijmegen, Gelderland, Netherlands. Role: defining processes, designing tooling, conducting experiments Requirements: 8+ years in semiconductor packaging development, expertise in assembly and die attach, experience with AutoCAD/SolidWorks, DoE and data analysis, knowledge of Ag/Cu sintering desirable, strong English communication. Category: Engineering Seniority: Senior Level Tools: AutoCAD, SolidWorks Commitment: Part Time Workplace: Hybrid Languages: English