About this role
Senior Power Packaging Engineer at Monolithicpower. Location: Shanghai, Shanghai, China. Role: designing PCB, leading packaging, developing processes Requirements: Bachelor's degree in relevant engineering, 5+ years experience in PCB/PCBA DFM and module-level packaging for high-voltage power systems; expertise in SMT, flip-chip, wire-bond, underfill, molding; SolidWorks/AutoCAD proficiency; familiarity with IPC standards. Category: Engineering Seniority: Senior Level Tools: SolidWorks, AutoCAD Commitment: Full Time Workplace: Onsite Languages: English