About this role
Advanced Packaging & Assembly Yield Analytics Engineer, Staff at Qualcomm Semiconductor Limited. Location: Hsinchu, Hsinchu, Taiwan. Role: driving yield, analyzing data, developing models Requirements: MS/PhD preferred; 5+ years semiconductor experience in package/assembly/yield analytics; strong statistical and root-cause skills; proficiency in JMP, Python, SQL, Power BI, Tableau, Excel; ability to travel in Asia. Category: Engineering Seniority: Senior Level Tools: JMP, Python, SQL, Microsoft Power BI, Tableau, Microsoft Excel Commitment: Full Time Workplace: Onsite Languages: English