About this role
• Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications. • This position is responsible for leading the packaging projects for New Product Introduction and New Technology Introduction. • Executing the projects to ensure that all the packaging deliverables are met to support a New product introduction and time to market. • You will coordinate activities across multiple organizations including marketing, IC design, applications, test, assembly engineering, internal and external manufacturing and you will be working with teams across multiple countries. • Effectively coordinate and lead complex technical discussion across multiple organizations and stakeholders in NXP internal and external. • Translating the product requirements for New product introduction in terms of package specific spec., reliability, cost.
Qualifications :
• Master’s or bachelor’s degree in Material Science, Electrical Engineering. • Proactive working attitude and capable to handle new challenge. • Analytically strong, drives for results, able to deal with ambiguities. • Ambitious, energetic, result-oriented entrepreneur with a strong drive for results. • People person and team player, very strong interpersonal skills • Related field along with at least 10 years of experience in semiconductor IC packaging. • Proficient risk assessment, risk mitigation and 8D skill. • Knowledge of related package platforms such as leadframe based, laminate substrate, flip chip, and Wafer Level Chip Scale Packaging is also expected. • Project management experience is required. • Fluent verbal and writing in both English and Japanese skills are required for communication with US/European teams and Japanese Customers/Suppliers.
Preferred Qualifications :
• Understanding of foundry process, assembly process, and failure analysis. • PMP and Six Sigma certification is preferred. • Good coomunication in both English and Japanese languages.
More information about NXP in Japan...
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