About this role
NXP’s Austin Technology and Manufacturing Center (ATMC) has an immediate opening for a Senior Thin Films Process Engineer. ATMC is NXP’s most advanced internal 200mm high volume manufacturing wafer fab, producing Automotive and Industrial products with our 90nm - 250nm Copper and Aluminum Process Technologies. The position requires ownership and responsibility for process control, process development, and optimization of semiconductor processes and equipment. This role plays a critical part in ensuring high levels of product quality, yield and process stability in a high-volume manufacturing environment. The ATMC Films Process Engineering group is responsible for all PVD, CVD and RTA processes within the factory.
Key Challenges
• Develop and optimize processes for silicon semiconductors. • Implement and maintain SPC (Statistical Process Control) and FDC (Fault Detection and Classification) systems. • Analyze metrology data to monitor material quality and drive improvements. • Reduce defectivity mechanisms and improve process control. • Participate in and/or lead cross-functional teams to exceed factory and functional area level Safety, Quality, Delivery and Cost goals. • Solve complex process and integration problems utilizing electrical, chemical and physical analysis techniques. • Lead troubleshooting and root cause analysis (8D/3x5WHY/Fishbone) for process deviations and yield issues. • Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities. • Drive equipment performance to maximize capacity and yield performance. • Improve cost performance of processes, equipment and production flows. • Demonstrate Technical Leadership through mentoring engineers and technicians to further develop the team. Job Qualifications
• Education: B.S., Masters or Ph.D degrees in Chemical, Materials Science, Mechanical or Electrical Engineering. • Job Experience: Greater than 10 years working in the Semiconductor Industry, within a High Volume Manufacturing wafer fab. Less is acceptable with advanced degrees (Masters/Ph.D). • Direct experience owning PVD, CVD or RTA processes. • Hands-on experiences with Applied Materials 5500 Endura PVD, Applied Materials 5200 Centura CVD/RTA, Applied Materials Producer CVD or Novellus HDP CVD systems. • Experience with install, start-up, qualification and release to production of PVD, CVD or RTA tools. • Experience with supporting or leading New Product Introduction / New Technology Introduction Factory Level Projects. • Experience using DOEs to optimize and improve either existing or new processes. • Positive interpersonal skills, highly energetic and self-motivated. • Excellent verbal and written communication skills. • Statistical Analysis skills: Six Sigma Green Belt or Black Belt preferred.
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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