About this role
RF/Microelectronics Packaging Engineer at Viasat, Inc.. Location: Tempe, Arizona, United States. Role: define packages, coordinate packaging, develop documentation Requirements: 10+ years in semiconductor packaging; Bachelor's in Electrical, Mechanical, Materials Engineering or related; knowledge of RF packaging, reliability, and thermal/electrical performance. Category: Engineering Seniority: Senior Level Tools: Cadence APD, SiP, Concept HDL, DxDesigner, Zuken, SolidWorks, Microsoft Excel Commitment: Full Time Workplace: Onsite Languages: English