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Failure Analysis Technician (Newbury Park, CA, US) @ Skyworks

Newbury Park, CA, USOnsiteFull-timePosted 11 days ago

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About this role

<p>If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.</p> <p> </p> <p>At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.</p> <p>Requisition ID: 77831 </p><div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px"><b>Description</b></H2> </div><div><p><span style="font-family:verdana, geneva, sans-serif">As a Failure Analysis Engineering Technician, you are responsible for supporting failure analysis engineering activities in the Newbury Park Failure Analysis Lab. You will work closely with key stakeholders as needed and use provided documentation (diagrams, written and verbal descriptions, layouts) to perform the requested analysis. </span></p></div></div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px"><b>Responsibilities</b></H2> </div><div><ul> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">External Visual Inspection.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">IR Inspection.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">X Ray (2D and 3D/CT reconstruction) of packaged components and electronic assemblies.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">Scanning Acoustic Microscopy (C-SAM) of packaged components.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">3D Surface Profiling of die and packaged components.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">IV Curve trace of package components.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">Re-balling, soldering/de-soldering, and re-work of packaged components and electronic assemblies.</span></li> <li style="line-height:105%;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;line-height:105%;color:black;font-family:verdana, geneva, sans-serif">De-capsulation (mechanical, acid, laser, and plasma), including die extraction.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">Mechanical cross section, ion milling, and parallel lapping/polishing and delayering, chemically-assisted ion beam etching, including high resolution imaging using desk-top SEM.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">Development of destructive analysis techniques for new packaging technologies.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">Maintain laboratory 5S program, including organization and inventory management of test hardware, equipment, and laboratory supplies.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">Train new hires and less experienced technicians as required.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;color:black;font-family:verdana, geneva, sans-serif">Additional duties as assigned.</span></li> </ul></div></div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px"><b>Required Experience and Skills</b></H2> </div><div><ul> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;font-family:verdana, geneva, sans-serif">Associate in engineering or science discipline (or equivalent years of experience) and 6+ yrs. related experience.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;font-family:verdana, geneva, sans-serif">Basic understanding of semiconductor packaging and process highly desired.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;font-family:verdana, geneva, sans-serif">Previous experience working in a semiconductor failure analysis lab, including performing decapsulation (mechanical, laser, acid), delayering (RIE, mechanical, wet etch), and soldering experience is required.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;font-family:verdana, geneva, sans-serif">Experience using electrical test equipment, including power supplies, multi-meters, oscilloscope, and probe station is preferred.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;font-family:verdana, geneva, sans-serif">Manual dexterity, attention to detail, organization, patience, and steady hand while often working with small ICs and detail-oriented tasks.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;font-family:verdana, geneva, sans-serif">Ability to complete work in a timely manner and prioritize jobs in accordance with requirements.</span></li> <li style="line-height:normal;font-size:11.0pt;font-family:verdana, geneva, sans-serif"><span style="font-size:12.0pt;font-family:verdana, geneva, sans-serif">Ability to work collaboratively and communicate effectively with team members and internal customers.</span></li> </ul></div></div><div style="padding:10.0px 0.0px;border:1.0px solid transparent"><div style="font-size:16.0px;word-wrap:break-word"><H2 style="font-size:1.0em;margin:0.0px"><b>Desired Experience and Skills</b></H2> </div><div><p><span style="font-family:arial, helvetica, sans-serif">.</span></p> <ul> <li style="font-family:arial, helvetica, sans-serif"><span style="font-size:12.0pt;font-family:arial, helvetica, sans-serif">Experience using electrical test equipment, including power supplies, multi-meters, oscilloscope, and probe station is preferred.</span></li> </ul> <p style="font-family:arial, helvetica, sans-serif"><span style="font-size:12.0pt;font-family:arial, helvetica, sans-serif">#LI-JR1</span></p></div></div></div><p>The typical base pay range for this role across the U.S. is currently USD $33.22 - $58.37 per hour. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance. </p> <p> </p> <p>Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [email protected].</p>

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Failure Analysis Technician (Newbury Park, CA, US) at Skyworks | ResuMinder Jobs