About this role
<p><br><img style="width:930.0px;height:205.0px" src="https://performancemanager5.successfactors.eu/OSRAMP/ams_OSRAM_RCM.jpg"></p> <p> </p> <p style="color:#fd5000">Sense the power of light</p> <p style="text-align:justify">The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on <a href="https://ams-osram.com">https://ams-osram.com</a></p> <p style="text-align:justify"> </p> <p style="text-align:justify">The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.<br><br><span style="color:#fd5000">Your new responsibilities</span></p><p>-Leading Package design and process integration, leading design &DFMEA review with global team</p> <p>-Generate and maintain building block knowledge and sharing, Leading for X-projects Building Block development for existing platform</p> <p>-Ensure synergies (standardize & minimize number of qualified materials) for new product/package platform, taking care on platform fitness and development, leading platform technical risk assessment</p> <p>-Enable and support Dt-X(design to cost/test/manufacturability)</p> <p>-Define Building Block design rules, regular alignment between site PDI's</p> <p>-Triger necessary projects for performance improvement for existing product/package platform (past Q5), Develop derivates/improve platform (test new materials, …)</p> <p>-Mentoring for new PDIs in WUXI, DMPC facilitator for new package &platform design workshop</p> <p>-Other tasks assigned by Supervisor</p> <p> </p><p><br><span style="color:#fd5000">What we look for</span></p> <p><br><table style="width:1611.56px;height:260.0px" border="0"> <tbody> <tr style="height:260.0px"> <td> <div> <div id="tor__fexperienceReq_div"><span id="sr-only-notify-tor__fexperienceReq"></span></div> <div id="tor__fexperienceReq_readOnlyDiv"> <div id="tor__fexperienceReq_content"> <p>-Bachelor degree or Master in Electrical /Electronic Engineering /semiconductor field</p> <p>-Above 8years working experience in LED process like die bonding, wire bonding, casting/molding, Trim &From and Sawing.</p> <p>-Experienced in package design, process integration, simulation, and project management, Familiar with DFMEA, DFSS, QFD and Six Sigma</p> <p>-CET-4 Minimum, CET-6 preferred. Familiar with Solidworks </p> <p>-Can fluently use different version of office software</p> <p>-Others: Able to work with stress and adapt to fast changes; Good team player.</p> </div> </div> </div> </td> </tr> </tbody> </table> <p> </p></p> <p><br>Please contact <strong>LuPing Zhu</strong> for further information via <strong><a href="mailto:[email protected]">[email protected]</a></strong> or <strong>+86 (510) 8190 8315</strong>.</p>