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Subproject Manager - Imaging EUV Metrology (m/f/x) @ Zeissgroup

2 LocationsOnsiteFull-time
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About this role

ZEISS Semiconductor Manufacturing Technology​ ​ Enabler for smaller, more powerful, and more energy-efficient microchips​ ​ Working for tomorrow today. ​ Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.

Your role As a Subproject Manager (Sub-Function Owner) you will:

• gather, coordinate and manage requirements for the image acquisition system and its interfaces definition at multi-disciplinary level

• provide project leadership to an agile development team and be responsible for their backlog for the design and development of image acquisition unit for a mask inspection machine in semiconductors industry

• supported by functional architects and Scrum Masters, you will assume responsibility for your functional team and its deliverables

• find and evaluate solutions and risks from both technical and economic perspectives

• manage internal and external development partners agilely using clearly defined KPIs

• be responsible for the execution of performance roadmap for the image acquisition modules to meet future product requirements

• provide target group-oriented reporting on the project status of the functional and corresponding documentation of the development results

Your profile

• a successfully completed degree in a natural science or engineering field with a focus on optics/mechatronics/systems engineering

• proven experience in managing complex, cross-functional projects in the semiconductor domain with full proficiency in project planning, resource allocation, risk management, and meeting deadlines, Project Management certification (e.g., PMP, Agile) preferred

• ability to lead multidisciplinary teams, including engineers, designers, and external vendors with strong interpersonal and communication skills to ensure alignment across stakeholders

• capability to identify and resolve technical challenges efficiently as well as executing technology roadmap to improve system performance and reliability

• team spirit and enjoyment of working in a globally operating team

• proficiency in both German and English (excellent written and spoken)

Your ZEISS Recruiting Team: Janina Kalmbach

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