About this role
Semiconductor Package Development Engineer at Universal Quantum. Location: Tokyo, Tokyo, Japan. Role: initiating packaging, driving development, developing packages Requirements: PhD-level engineering expertise required; business-level Japanese and English; package design, CAD, thermo-mechanical and FEM simulation, micro-assembly, electro-mechanical testing, semiconductor manufacturing and reliability problem-solving. Category: Research and Development (R&D) Seniority: Senior Level Tools: CAD tools, Thermo-mechanical Simulation, Finite Element Modelling (FEM) Commitment: Full Time Workplace: Hybrid Languages: Japanese, English