About this role
Principal Engineer, Package Design at SiTime. Location: Santa Clara, California, United States. Role: developing packaging, leading design, managing osats Requirements: M.S. or PhD in Mechanical Engineering/Materials Science, 10+ years semiconductor IC packaging experience, OSAT management, DoE development, knowledge of QFN/WLCSP/flip-chip, thermal/stress/electrical modeling, and CAD experience (AutoCAD). Category: Engineering Seniority: Senior Level Tools: AutoCAD Commitment: Full Time Workplace: Onsite Languages: English