About this role
Senior Equipment Engineer – Wafer Lamination & Mounting (f/m/d) at Black Semiconductor GmbH. Location: Aachen, North Rhine-Westphalia, Germany. Role: optimizing equipment, leading troubleshooting, driving analysis Requirements: Bachelor's in engineering or equivalent experience, 5+ years semiconductor equipment engineering (back-end/advanced packaging), hands-on wafer tape-frame equipment experience, knowledge of pneumatics/servo/robotics/motion control/vacuum, cleanroom experience. Category: Engineering Seniority: Senior Level Tools: Takatori, Disco, Adwill-Lintec, Tazmo, FDC Commitment: Full Time Workplace: Onsite Languages: English