About this role
Sr. Manager Packaging Engineering at AMD. Location: Markham, Ontario, Canada. Role: leading execution, mentoring team, driving automation Requirements: Leadership in semiconductor package design for data-center GPUs, team management, cross-functional collaboration, experience with OSATs/substrate vendors, familiarity with Synopsys 3DICC and Cadence SiP/APD, BS in engineering required. Category: Engineering Seniority: Senior Level Tools: Synopsys 3DICC, Cadence SiP, Cadence APD, AI/ML Commitment: Full Time Workplace: Hybrid Languages: English