About this role
Senior 3D Packaging & Tooling Engineer at QuantWare. Location: Delft, Netherlands, Netherlands. Role: Tooling adaptation, Process development, 3D integration Requirements: BS/MS/PhD in Mechanical Engineering, Mechatronics, Physics, or Materials Science; 7+ years in high-accuracy semiconductor assembly; <1µm placement; 3D integration knowledge. Category: Engineering Seniority: Senior Level Tools: flip-chip bonder, die attach equipment, thermo-compression bonding, laser-assisted bonding, vacuum/cryogenic compatibility Commitment: Full Time Workplace: Onsite Languages: English