About this role
Field Application Engineer at Boston Materials. Location: Taipei or Taiwan. Role: leading integration, supporting trials, capturing requirements Requirements: Bachelor's degree in engineering or materials science, 3+ years experience in semiconductor packaging/electronics/TIM/applications engineering, CAD and prototyping experience, thermal/mechanical testing and data analysis, system-level thermal design knowledge, bilingual Mandarin and English. Category: Engineering Seniority: Mid Level Tools: CAD, C-SAM, X-ray, FEA, thermal test setup Commitment: Full Time Workplace: Field Languages: Chinese, English