About this role
Packaging Engineer(183481) (183481) at AMD. Location: Hsinchu, Taiwan. Role: improving yield, standardizing processes, managing changes Requirements: Packaging Engineer with experience in bump, interposer, and fan-out RDL processes; MS in Mechanical, Materials, or Chemical Engineering preferred. Category: Engineering Seniority: Mid Level Tools: RDL, Bump, Interposer, Fan-Out, DOE, JMP Commitment: Full Time Workplace: Onsite Languages: English