About this role
Senior Packaging Engineer at Power Integrations. Location: Malaysia. Role: own packaging, troubleshoot production, maintain RTM Requirements: B.S. in engineering; 2+ years in semiconductor back-end assembly; wirebond/leadframe experience; SPC/8D/FMEA; OSAT-based role; willing to base at OSAT site in Malaysia Penang. Category: Engineering Seniority: Senior Level Tools: Wirebond, Leadframe design, Clipping, Plating, Molding/Encapsulation, 8-D, FMEA, DOE, SPC, QC/FA tools, X-ray, SEM, Decap, Cross-section Commitment: Full Time Workplace: Onsite Languages: English