About this role
Manufacturing Engineer at Amphenol. Location: Fremont, California, United States. Role: Develop packaging processes, Qualify new package types, Lead DfX/DfM reviews Requirements: BS in Materials/Electrical/Mechanical Engineering; 3+ years in semiconductor or sensor packaging/process development; 2+ years hands-on packaging/assembly; experience with die attach, wire bonding, flip-chip, molding/encapsulation, soldering, failure analysis; strong DOE and statistical skills; experience documenting processes and PPAP/APQP for automotive/aerospace; excellent communication. Category: Engineering Seniority: Mid Level Tools: Minitab, JMP, Excel, Wire bonders, Flip-chip bonders, Die bonders, Reflow ovens, Mold presses, Plasma cleaning tools, Pick-and-place, X-ray/CT, SEM, C-SAM, Environmental chambers Commitment: Full Time Workplace: Onsite Languages: English