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R&D Engineer - Thermoformed Packaging @ Toppan

Franklin Park, Illinois, USOnsiteFull Time
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About this role

R&D Engineer - Thermoformed Packaging at Toppan. Location: Franklin Park, Illinois, United States. Role: lead projects, develop packaging, collaborate teams Requirements: BS/MS in engineering; 5+ years plastics manufacturing; extrusion, thermoforming expertise; knowledge of HIPS/PET/PP/PE resins; project leadership; onsite in Franklin Park, IL; up to 25% travel. Category: Engineering Seniority: Mid Level Tools: extrusion, thermoforming, tooling, polymer science, packaging materials Commitment: Full Time Workplace: Onsite Languages: English

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