About this role
Equipment Engineer at NXP. Location: Kuala Lumpur, Selangor, Malaysia. Role: lead packing, update SOP, coordinate supplier Requirements: Engineering degree required; experience in semiconductor manufacturing and packaging; strong communication; ability to multi-task. Category: Engineering Seniority: Mid Level Tools: Enovia, Beeline, GMDM, MMPR, APL Commitment: Full Time Workplace: Onsite Languages: English