About this role
Holefill Process Engineer at Ttmtech. Location: Syracuse, New York, United States. Role: interface processes, analyze issues, perform DOE Requirements: Bachelor’s in Chemical, Electrical, or Mechanical Engineering; 1-4 years as a Process Engineer; PCB fabrication experience a plus; strong analytical and problem-solving skills. Category: Engineering Seniority: Mid Level Tools: DOE, CAPA, Process Control Software Commitment: Full Time Workplace: Onsite Languages: English