About this role
• Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR. • Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA). • Perform die extraction for various package types and execute layer-by-layer polishing at the die level. • Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques. • Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions. • Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies. • Demonstrate a strong understanding of semiconductor manufacturing processes.
Job Qualifications
• Bachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or a related field. • Proven experience (3+ years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus. • Hands-on experience with a broad range of FA sample preparation tools and techniques. • Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.
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