About this role
Job Summary: Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Blade Dicing, Backgrind, or DBG processes.
Job Responsibility
• Define/optimize procedures to ensure smooth processing of production lots • Develop and maintain process documentation and SOPs including operator training • Lead root cause analysis for defects and yield losses • Provide disposition on lots with quality issues • Support new product introduction and process qualification • Analyze production data to identify process improvements • Collaborate with cross-functional teams on cost reduction and process improvement projects • Perform change management including new material qualification
Qualification
• Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field). • 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process. • Strong data analysis and problem-solving skills. • Experience with Statistical Process Control (SPC) and process validation (preferred). • With good command of English language. • Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).
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