About this role
Your Tasks:
• You will work on complex bonding tasks in the field of microelectronic packaging • You will develop customer-specific solutions through to process integration • You will provide technical advice to our demanding customers at home and abroad • You implement technologies in the production process of the respective customer in cooperation with sales and product management • You carry out feasibility studies and derive the necessary consequences • You have knowledge of the current state of the art and continue to expand your technical expertise
Your Skills:
• Degree in engineering in the field of microelectronics, physics, semiconductor technology, electrical engineering, materials science, etc. • Several years of professional experience in project work and / or project management in the field of semiconductor packaging • Enthusiasm for the engineering development of process solutions in semiconductor technology • An analytical and cross-departmental way of thinking, initiative, ability to work in a team and very good organizational skills • Willingness to travel internationally to visit customers and work with our colleagues abroad • Very good command of written and spoken English
Your Benefits:
• Job security with a global employer
• Strong team spirit with team events, company outings and Christmas parties
• Plenty of room for growth, working in rapidly growing and innovative markets
• 30 days vacation, flexible hours and working from home options
• Opportunities for development thanks to continuous growth and our DELO Academy
• Voluntary social benefits such as special payments, allowances for travel and dining
• State-of-the-art office and laboratory buildings with a campus atmosphere
• Mental health and fitness programs