About this role
Senior Packaging Engineer at Arago. Location: Paris, Île-de-France, France. Role: designing packaging, managing subcontractors, industrializing chips Requirements: Master's in EE or IC design, 5+ years in semiconductor/photonic packaging, expertise in heterogeneous integration, thermal/mechanical/EM simulation, photonic alignment, and experience with packaging tools and manufacturing scale-up. Category: Engineering Seniority: Senior Level Tools: Cadence Allegro Package Designer, Altium, Cadence Virtuoso, Cadence Sigrity, ANSYS Mechanical, HFSS, SIwave Commitment: Full Time Workplace: Onsite Languages: English